Author: Tektronix
Upload: Peter Pham
Last Update: Jan. 2019
Abstract: This application note describes considerations and techniques for making accurate current measurements on power converters using an oscilloscope and a current probe.

Keyword: Current measurement, current probe, oscilloscope
Indexing Keyword: Current Measurement

Provider: Wen Zhang
Last Update: Feb. 2018
Abstract: The impedance analyzer is often used to quantify the impedance of a device or set of devices (ex: LC circuit) over a defined frequency range. It is handy when tuning resonant circuits, quantifying ESR of reactive components, and much more. This tutorial discusses general use of the impedance analyzer, the different fixture components that allow you to interface with the device, and how to calibrate the analyzer for proper measurements.

Keyword: Impedance analyzer
Indexing Keyword: Impedance Analyzer

Provider: Evan McKee
Last Update: Feb. 2019
Abstract: Instant Pots are gaining popularity as the best way to make a delicious meal quickly. However, many people buy Instant Pots only to let them sit untouched in a box for a month because they don’t know where to begin. This tutorial is meant to take the fear out of using an Instant Pot, and to keep aspiring users from getting overwhelmed. These tips represent the first things you should know about using this tool to make meals of your own.

Keyword: Instant Pot, pressure cooker, cooking, recipes
Indexing Keyword: Instant Pot

Provider: Evan McKee
Last Update: Jan. 2019
Abstract: The purpose of this tutorial is to teach someone who has never soldered how to begin using a pencil tip soldering iron. The tutorial is geared toward working with small electronics and is divided into two parts: Part I contains basic, start-from-scratch knowledge about soldering, and Part II contains links to video tutorials on the actual act of soldering. The tutorial takes approximately 30 minutes to complete.

Keyword: Soldering, soldering iron, soldering gun, flux, oxidation
Indexing Keyword: Soldering

Provider: Handong Gui
Last Update: Feb. 2019
Abstract: The temperature chamber is usually used to test components at different temperatures especially at high temperatures. This tutorial provides basic usage of the Delta Design temperature chamber in the lab.

Keyword: Temperature chamber, Delta Design
Indexing Keyword: Temperature Chamber

Provider: Ling Jiang
Last Update: Feb. 2018
Abstract: The thermal camera is a good way to quickly troubleshoot circuits (if the malfunctioning component is heating up), “sanity-check” loss levels, and compare component heats. When used on a circuit, the temperatures reported by the camera should not be assumed to be precise as different component surfaces reflect light in different ways. This leads to skew of thermal measurements. It is best to used the camera to verify general operation.

Keyword: Thermal Camera, flir, temperature
Indexing Keyword: Thermal Camera

Provider: William Pierce
Last Update: March 2019
Abstract: Keithley 7510 multimeter is billed as the first DMM with an integrated 1 Msample/sec 18-bit digitizer for capturing waveforms and displaying them. This feature lets users explore measurements by using a number of techniques that until now have only been available by hooking up an oscilloscope. The first tutorial video demonstrates how to use capture waveforms and analyze them right on the multimeter without connecting to a PC.
The second video provides an overview of implementing corrective measures when making low resistance measurement using 4 wire method. The 2-wire measuring method is not suitable for low resistance measurement.

Keyword: Multimeter, waveform capture, low resistance measurement
Indexing Keyword: Keithley 7510 Multimeter

Provider: Xingyue Tian
Last Update: May. 2021
Abstract: Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz

Keyword: Wire bonding,package,DBC
Indexing Keyword: Package