wiki:labequiptuts

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wiki:labequiptuts [2019/03/28 13:18] – ppham3wiki:labequiptuts [2021/10/27 23:22] (current) – xtian7
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 +<WRAP center 50%><WRAP centeralign box round> 
 + ====  Wire bonding Machine in MK.533 ====  
 +</WRAP></WRAP> 
 +<WRAP left 10% rightalign>[[https://www.youtube.com/watch?v=_TRydDjoCgA|{{:wiki:video_icon.png?80|HB30}}]]</WRAP> 
 +<WRAP right 85% right leftalign box round> 
 +**Provider:** Xingyue Tian\\ 
 +**Last Update:** May. 2021\\ 
 +**Abstract:** Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz\\ \\ 
 +**Keyword:** Wire bonding,package,DBC\\ 
 +**Indexing Keyword:** Package 
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  • wiki/labequiptuts.txt
  • Last modified: 2021/10/27 23:22
  • by xtian7